DisplayLink Named As Best Of CES Innovations 2011 Design And Engineering Award Honoree
PALO ALTO, Calif., and NEW YORK, Nov. 9, 2010 – DisplayLink Corp. has been named an International CES Best of Innovations 2011 Design and Engineering Awards Honoree in the Enabling Technologies category for its new SuperSpeed USB (USB 3.0) chip platform for next-generation displays, docking stations and other integrated devices.
Products entered in this prestigious program are judged by a preeminent panel of independent industrial designers, engineers and members of the media to honor outstanding design and engineering in cutting-edge consumer electronics products across 35 product categories.
The Best of Innovations Honorees are the products that received the top score in their category.
The DisplayLink SuperSpeed USB single-chip family includes integrated display and networking connectivity, high performance audio and HD video support. In addition, they feature third-generation DisplayLink adaptive real-time compression technology that dynamically manages bandwidth, taking full advantage of bi-directional throughput of SuperSpeed USB. This means multiple full HD videos, high-resolution graphics and networking data can be processed simultaneously, while also substantially increasing today’s HighSpeed USB (USB 2.0) graphics performance and enabling graphics delivery over gigabit Ethernet.
Products with integrated DisplayLink SuperSpeed USB technology are expected to reach the market in the first half of 2011.
“With speeds up to 10 times faster than the previous generation – transferring data at speeds up to 5Gbps – our newest chips will help manufacturers unleash a host of next-generation, creative devices,” says Dennis Crespo, executive vice president of marketing and business development at DisplayLink. “This CES Innovations award further validates the strength of our technology and the value it will offer to OEMs and consumers alike.”
The prestigious Innovations Design and Engineering Awards have been recognizing achievements in product design and engineering since 1976. It is sponsored by the Consumer Electronics Association (CEA)®, the producer of the International CES, the world’s largest consumer technology tradeshow.
DisplayLink’s SuperSpeed USB 3.0 chips will be displayed at the 2011 International CES, Jan. 6-9 in Las Vegas, in the USB TechZone booth 36505 and MP25231. The Innovations Design and Engineering Showcase will feature honorees by product category in the Grand Lobby of the Las Vegas Convention Center and will also be featured at CES Unveiled: The Official Press Event of the International CES on Tuesday, Jan. 4.
The Innovations entries are judged based on:
• Engineering qualities, based on technical specs and materials used.
• Aesthetic and design qualities.
• The product’s intended use/function and user value.
• Unique/novel features that consumers would find attractive.
• How the design and innovation of the product compares to other products in the marketplace.
Products chosen as Innovations honorees reflect innovative design and engineering of the entries. Examples may include the first time various technologies are combined in a single product or dramatic enhancements to previous product designs. Innovations 2011 Design and Engineering honoree products are featured at www.CESweb.org/Innovations, which lists product categories, as well as each product name, manufacturer information, designer, description, photo and URL.
DisplayLink Corp. (www.displaylink.com) is a chip and software company that enables easy, virtual graphics connectivity between computers and displays over standard interfaces like USB, Wireless USB and Ethernet. Its technology is found in dozens of globally branded PC accessories including monitors, docking stations, display adapters, projectors and thin client systems that make it easy to expand the desktop visual workspace at significantly lower cost and power than traditional solutions. For more information and product details visit the DisplayLink Shop.